USB-C Receptacle 24 Pin Mid-Mount — USB-TC24-F11 SMT Mid-Mount USB-C 24-Pin Jack for Ultra-Thin Laptops, Tablets & IoT Devices

The USB-TC24-F11 USB-C receptacle is a 24‑pin mid‑mount SMT USB Type‑C connector engineered for next‑generation ultra‑slim devices. Its mid‑mount design places the receptacle mouth precisely within a PCB cutout, reducing overall height above the board to nearly zero. This USB-C receptacle 24 pin mid-mount enables device enclosures as thin as 5mm, making it the preferred choice for modern laptops, tablets, AR/VR headsets, and IoT sensor modules where every fraction of a millimeter counts.

Despite its low profile, the connector delivers full USB 3.2 Gen 2 performance with all 24 pins available: SuperSpeed TX/RX pairs, sideband (SBU), configuration channel (CC), and multiple VBUS/GND returns. It supports USB Power Delivery up to 100W (20V/5A), DisplayPort Alternate Mode, and backward compatibility with USB 2.0. A stainless steel mid‑plate inside the receptacle tongue provides mechanical robustness against daily plug insertions, while gold‑plated contacts maintain a stable connection over the product’s lifetime. Designed for automated SMT assembly, the USB-TC24-F11 comes in tape‑and‑reel packaging and withstands lead‑free reflow temperatures up to 260°C.

PCB Cutout Dimensions

The USB-TC24-F11 requires a precisely routed rectangular cutout in the PCB. Recommended cutout size: 8.40mm × 4.90mm. Maintain a minimum web thickness of 2.0mm from the cutout edge to the nearest board outline to prevent breakage during depaneling. The connector’s locating pegs will self‑align the part into the cutout during placement.

High‑Speed Signal Routing

All SuperSpeed differential pairs (TX1±, RX1±, TX2±, RX2±) must be length‑matched within 5 mil and impedance‑controlled to 90 Ω ±10%. Place ESD protection diodes as close as possible to the connector pads. Route VBUS and GND with wide traces or polygons to handle 5A continuous current with minimal voltage drop.

SMT Stencil & Reflow

Use a 0.1mm or 0.12mm thick laser‑cut stainless steel stencil with aperture openings reduced to 80% of pad area for fine‑pitch signal pads. Type 4 SAC305 lead‑free solder paste is recommended. The connector is MSL 1 and requires no pre‑bake. Peak reflow temperature should reach 245–260°C with a time above 217°C of 60–90 seconds. After soldering, inspect for coplanarity and ensure no bridging on the fine‑pitch pads.

When every millimeter of device thickness matters, the USB-C receptacle 24 pin mid-mount offers a decisive advantage. A top‑mount connector sits entirely above the PCB, adding at least 2.0mm to the product stack‑up. A vertical connector extends upward, requiring the board to be placed at the device edge. The mid‑mount approach, however, embeds the connector body into a PCB cutout, making the receptacle tongue nearly flush with the board surface. This allows the enclosure to close tightly around the connector without a bulge, enabling industrial designs as thin as 5mm.

Mechanically, the mid‑mount design also strengthens the assembly. Because the shell is soldered to both top and bottom PCB pads and braced by the board thickness itself, lateral stresses from cable plugging are distributed into the PCB rather than concentrated on the solder joints. This reduces the risk of pad lifting or shell detachment over thousands of insertions — a common failure point in top‑mount connectors used in portable devices. For ultra‑slim laptops, tablets, and wearables, the mid‑mount USB-C connector is the definitive solution for full‑featured, robust connectivity.

The USB-TC24-F11 has passed a rigorous qualification program that guarantees 10,000 insertion cycles and compliance with USB‑IF mechanical and environmental standards. Key test results include:

• Mating Durability: 10,000 insertion/extraction cycles at 200 cycles/hour with a certified USB Type‑C plug. Contact resistance stayed below 80 mΩ, and no physical damage was observed on the tongue.
• 4‑Axis Mechanical Stress: Withstood a 15 N side‑pull force applied 2 mm from the receptacle face for 60 seconds in all four directions. Solder joints and shell tabs remained intact.
• High‑Speed Signal Integrity: Tested with USB 3.2 Gen 2 (10 Gbps) compliance patterns. Eye‑diagram opening exceeded minimum USB‑IF mask requirements at both 5 Gbps and 10 Gbps after 10,000 cycles.
• Thermal Shock: 200 cycles between −40°C and +85°C per IEC 60068‑2‑14. No solder joint cracks detected via X‑ray inspection, and contact resistance drift was less than 10 mΩ.
• Mixed Flowing Gas: 96‑hour Class II exposure per IEC 60068‑2‑60. Gold plating protected contacts from corrosion; low‑level contact resistance remained below 50 mΩ.

For a complete test report or to discuss custom qualification, contact engineering@vistarelectronics.com.

All USB-TC24-F11 USB-C receptacle units are shipped in sealed dry‑pack tape & reel (800 pieces per 13‑inch reel) with MSL 1 designation, eliminating the need for pre‑baking. The connector is lead‑free and fully compatible with SAC305 solder. Customizations including higher gold thickness (up to 50µ”), alternative shell plating, or IP67 sealing gaskets are available on request. Standard MOQ is 1,000 pieces. To request a free sample or volume price, email sales@vistarelectronics.com with your company details and project description.