USB 2.0 type C connector male 9 Pin mid mount right angle

The USB-TC09-M02 USB 2.0 Type C connector is a mid‑mount SMT receptacle designed to sit within a precision cutout on the PCB, effectively lowering the connector’s top surface to nearly flush with the board. This innovative USB 2.0 Type-C connector 9 pin mid-mount architecture enables slimmer product enclosures—critical for modern smartphones, wearables, IoT sensors, and portable medical devices that cannot afford the extra millimeter added by conventional top‑mount connectors.

By embedding the connector body partially below the PCB surface, the mid‑mount design not only reduces overall height but also improves side‑load resistance. The 9‑pin configuration carries all necessary USB 2.0 signals (VBUS, D+, D‑, GND, and CC/VCONN for plug orientation and power delivery negotiation) while maintaining full backward compatibility with every standard USB Type‑C cable. Gold‑over‑nickel contacts on phosphor bronze guarantee a stable 50 mΩ initial contact resistance, and the stainless steel mid‑plate reinforces the receptacle tongue for long‑term durability, tested to 10,000 insertion cycles.

Engineers will appreciate the tape‑and‑reel packaging, full lead‑free reflow compatibility, and RoHS 3/REACH compliance that makes the USB-TC09-M02 a drop‑in solution for high‑volume assembly. Whether you are designing a fitness tracker, a smart lock, or a handheld diagnostic tool, this USB 2.0 Type-C female connector 0.5A delivers a reliable, space‑saving interface for charging and data transfer.

PCB Cutout Dimensions

The USB-TC09-M02 requires a precisely routed rectangular cutout in the PCB. The recommended cutout size is 8.20mm × 4.70mm, positioned so that the connector’s locating pegs snap into the board edge. Maintain a minimum web thickness of 2.0mm from the cutout to the nearest board edge to prevent breakage during panel handling.

SMT Stencil & Paste

Use a 0.1mm or 0.12mm thick laser‑cut stainless steel stencil. Aperture openings for the 9 SMT pads should be reduced to 80% of the pad area to avoid solder bridging, especially near the fine‑pitch signal pads. Type 4 or Type 5 SAC305 solder paste is recommended.

Pick‑and‑Place

The connector is supplied in tape‑and‑reel with a vacuum‑compatible flat top surface. Use a nozzle tip diameter of at least 3.0mm. Placement force should be limited to 3N to avoid pre‑bending the shell. The locating pegs will self‑align the part into the PCB cutout.

Reflow Profile

Follow JEDEC J‑STD‑020 for lead‑free reflow. Peak temperature: 245–260°C. Time above 217°C: 60–90 seconds. Because of the connector’s thermal mass, consider increasing the soak time by 10–20 seconds. The USB-TC09-M02 is MSL 1 and requires no pre‑bake if stored under 30°C/60%RH.

When every tenth of a millimeter counts, a USB 2.0 Type-C 9 pin mid-mount SMT receptacle like the USB-TC09-M02 offers a decisive advantage. A traditional top‑mount connector sits entirely above the PCB, adding at least 2.0mm to the total thickness of the product stack‑up. In contrast, the mid‑mount style places the connector body partially below the PCB surface by occupying a dedicated cutout. The connector tongue ends up flush with or slightly recessed into the board, meaning the enclosure can close tightly around it without a bulge.

Mechanically, the mid‑mount approach also strengthens the assembly. Because the connector shell is soldered to both the top and bottom PCB pads and is braced by the board thickness itself, lateral stresses from cable plugging are distributed into the PCB rather than concentrated on the solder joints. This reduces the risk of pad lifting or shell detachment after thousands of insertions, a common failure point in top‑mount designs used in pocket‑carried devices.

From a signal integrity standpoint, the mid‑mount configuration keeps the USB data traces shorter and more direct, as they do not need to climb over the board edge. This helps maintain 90 Ω differential impedance for the D+/D‑ pair, ensuring reliable USB 2.0 communication at 480 Mbps.

The USB-TC09-M02 has been subjected to a comprehensive test suite to validate its 10,000‑cycle durability and environmental resilience. Key test results include:

• Mating Durability: 10,000 insertion/extraction cycles with a USB Type‑C plug at 500 cycles/hour. Contact resistance remained below 100 mΩ (initial: 50 mΩ).
• 4‑Axis Mechanical Stress: The connector withstood a 10 N side‑pull force applied 2 mm from the receptacle face for 60 seconds in each direction without shell deformation or electrical discontinuity.
• Thermal Shock: 100 cycles between −40°C and +85°C per IEC 60068‑2‑14. No solder joint cracks or contact resistance drift beyond 30 mΩ.
• Mixed Flowing Gas (MFG): 48‑hour exposure to Class 2 environment per IEC 60068‑2‑60. Gold plating prevented any visible corrosion, and low‑level contact resistance (<100 mΩ at 20 mV) remained stable.
• Salt Spray: 24 hours of 5% NaCl fog per IEC 60068‑2‑11. Nickel‑plated shell showed no red rust, and electrical functionality was fully retained after rinsing.

For a detailed qualification report, please contact engineering@vistarelectronics.com.

All USB-TC09-M02 USB 2.0 Type-C connector units are shipped in dry‑packed tape & reel (1,000 pieces per 13‑inch reel) with a moisture sensitivity level (MSL) of 1, meeting J‑STD‑020 requirements. The connector is fully lead‑free and compatible with SAC305 solder paste. Custom options include IP67 sealing with a silicone gasket, different gold thickness (up to 0.76 µm), and EMI‑enhanced shells. Standard MOQ is 1,000 pieces. To request a free sample or volume quotation, contact sales@vistarelectronics.com with your company details and project description.