Des: 4Pin SMT DC Power Jack Gold plated PCB mounting DC connector female SMD right angle
Part No: DC-085
Specification:
Rating: DC 30V 0.5A
Insertion & extraction Force: 3-20N
Life test: 5,000 Cycles
Packaging: Bag/Tray

Des: 4Pin SMT DC Power Jack Gold plated PCB mounting DC connector female SMD right angle
Part No: DC-085
Specification:
Rating: DC 30V 0.5A
Insertion & extraction Force: 3-20N
Life test: 5,000 Cycles
Packaging: Bag/Tray
FPC connectors are a type of electrical connector used to establish a reliable and flexible connection between a flexible printed circuit board and other electronic components or devices. Many pitches are available, such as 0.3 mm, 0.5 mm, 1.00 mm, 1.25 mm, 2.54 mm, but the most common pitches are 0.500 mm, 1.00 mm, and 1.25 mm. A single FFC can have different pitches between different conductors on the same cable, however this is uncommon. There are 0.3mm pitch, 0.5mm and 1.0mm pitch zif/non-zif types FPC Connectors with different heights
USB type c Waterproof are commonly found in smartphones, action cameras, and other devices, and proper use can effectively extend their life and maintain waterproof performance. Here are the detailed notes: I. Safety Protocols II. Proper Handling & Maintenance III. Environment & Compatibility IV. Regular Maintenance V. Professional Care VI. Emergency Response VII. Device-Specific Recommendations VIII. Troubleshooting Common Issues IX. Industry Standards & Certifications X. Future-Proofing & Tech Trends XI. User Case Studies
1. Unmatched Protection for Demanding Environments In a world increasingly reliant on technology, the demands placed on connectors are higher than ever. Waterproof USB-C connectors deliver robust defense against moisture and dust, with IP ratings spanning IPX5 (water jet resistance) to IPX8 (continuous underwater operation). This capability is particularly crucial for devices used in harsh environments, ranging from outdoor consumer electronics to industrial applications. Advanced models like the JAE DX07 series achieve a 20% size reduction via liquid injection molding (LIM), maintaining durability without compromising portability. This makes them ideal for portable devices that require both
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